Air Cooling Solar Cell Laser Cutting tool/ quantum cutting with Foot Switch
※Application Field of silicon wafer dicing machine
Scribing means, cutting of a grid pattern of grooves in a semiconductor material generally for the purpose of marking interconnections or to cut the solar cells into two parts. it is also know as silicon etching machine ,laser scribing machine , solar cell laser cutting ,laser scribing solar cells
※Product Features of silicon wafer dicing machine
1.Fiber Laser and strong suitability for the environment
2.High efficiency electro-optical conversion.
3.High precision and Air cooling
4.Stable and continuous processing but lower operation cost
5.Easy&convenient operation
6.Maintenance-free for 50000hours(no damageable parts&consumable parts be replaced)
7.Better quality beam(Base mode TEM00) & thinner cutting gap and smoother edge
8.Software updated to 5.0
9.Touch screen control,servo motor for option
10.Automatic absoption and without foot pedal
11.Imported Core parts
※Product Introduction of silicon wafer dicing machine
Perfect Laser produced a new generation of New Full automatic silicone solar cell laser cutting machine mainly used for metal and silicon, germanium, gallium arsenide and other semiconductor material substrate scribing and cutting, machinable solar panels, silicon, ceramic , aluminum foil, etc., Artifacts refinement and blazonry, trimming smooth. Adopting Continuous pumping acousto-optic adjustable Q’s Nd: YAG laser as work light source, The two-dimensional work table is controlled by computer,and could do kinds of movement according to what graphics be input in.High output power, high precision scribing, fast speed and could cut curve and straight line graph.
※Product Advantage of silicon wafer dicing machine
1.The core parts adopt imported brand;
2.Fiber Laser has stronger adaptability to the environment;
3.Better beam quality(basic modeTEM000),thinner kerf width, more smooth edges;
4.Higher conversion efficiency, lower running cost, smaller equipment volume (air cooling);
5.The laser pulse width are more narrow, higher peak power, faster scribing speed;
6.[Battery Cell automatic adsorption ,don’t need pedal;]
7.For a long time continuous operation without maintenance, no consumable parts replacement;
8.Software upgrade to version 5.0,parameters of concentrated control, software configurations save;
9.Touch screen operation, serve motor driving(optional).
※Technical Parameter of silicon wafer dicing machine
| Model specification | PE-20W/50W Laser Scribing Machine | |
| Laser wavelength | 1064nm | |
| Laser power | 20W | |
| Scribing line width | 50um | |
| Scribing speed | 240mm/s | |
| Scribing precision | ±10um | |
| Workbench wide | 200×200mm | |
| Temperature control precision | 0.5℃ | |
| Working power supply | 220V/50Hhz/1.5KVA | |
| Workbench | Cell automatic adsorption, dust removal | |
| Cooling way | High precision and constant temperature circulating water cooling professional integration | Air cooling |
※Samples of silicon wafer dicing machine
※Packaging & Delivery
1. Prompt deliver at the very day.
2. Well-trained and disciplined packing team.
3. After-sale service:. Any questions or problems after receiving the product, please feel free to contact us. Problems would be solved for you immediately.
4. Sophisticated and professional logistic agent.
※Competitive Advantages
1. 100% custom pass guaranteed.
2. Our products have been exported to Germany, Norway, Poland, Finland, Spain, UK, France, Russia, USA, Brazil, Mexico, Australia, Japan, Korea, Thailand, Indonesia, Uruguay and many other countries.
3. Flexible and Untraceable payment terms.
4. Good after-sale service.
5. We offer high quality products at competitive price in quick delivery.
